Shah Idil, Ahmad; Donaldson, Nick; (2017) Thin Film Options for Implanted Medical Devices. Presented at: MicroTech 2017 – Advanced Packaging & Technology Trends, Didcot, UK.

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Abstract

The miniaturisation of chronically implanted neuroprostheses and neuromodulators requires thin-film technologies that remain stable in the harsh physiological environment. Implanted metals must resist corrosion in saline, withstand oxidative species generated during inflammation, and remain biocompatible across physiological pH ranges (5.6–9.0). Of the five most common thin film interconnect metals (Au, Pt, Ag, Cu, Al), only platinum and gold are suitable, while eleven additional metals—six noble (Au, Ir, Rh, Ru, Pd, Os) and five self-passivating (Ti, Ta, Nb, Zr, Cr)—offer potential use. Device functionality typically demands multilayer metal stacks, where noble metals provide conductivity and biostability, and passivating metals serve as adhesion or diffusion barrier layers. Optimising corrosion-resistant metallic stacks (e.g., Ti/Pd/Au) is therefore essential. While Au enables wire- and rivet-bonding, hermetic seals for integrated circuits may require eutectic alloys (Au-Sn, Au-Si), which must be protected against fluid ingress. This work proposes systematic evaluation of metals and combinations for corrosion resistance, alongside protective encapsulation strategies, to advance reliable implantable micropackaging.

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