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In-body wireline interfacing platform for multi-module implantable microsystems

Haci, D; Mifsud, A; Liu, Y; Ghoreishizadeh, SS; Constandinou, TG; (2019) In-body wireline interfacing platform for multi-module implantable microsystems. In: Proceedings of the 2019 IEEE Biomedical Circuits and Systems Conference (BioCAS). IEEE: Nara, Japan. Green open access

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Abstract

The recent evolution of implantable medical devices from single-unit stimulators to modern implantable microsystems, has driven the need for distributed technologies, in which both the implant system and functions are partitioned across multiple active devices. This multi-module approach is made possible thanks to novel network architectures, allowing for in-body power and data communications to be performed using implantable leads. This paper discusses the challenges in implementing such interfacing system and presents a platform based on one central implant (CI) and multiple peripheral implants (PIs) using a custom 4WiCS communication protocol. This is implemented in PCB technology and tested to demonstrate intrabody communication capabilities and power transfer within the network. Measured results show CI-to-PI power delivery achieves 70 % efficiency in expected load condition, while establishing full-duplex data link with up to 4 PIs simultaneously.

Type: Proceedings paper
Title: In-body wireline interfacing platform for multi-module implantable microsystems
Event: 2019 IEEE Biomedical Circuits and Systems Conference (BioCAS)
ISBN-13: 9781509006175
Open access status: An open access version is available from UCL Discovery
DOI: 10.1109/BIOCAS.2019.8918756
Publisher version: http://dx.doi.org/10.1109/BIOCAS.2019.8918756
Language: English
Additional information: This version is the author accepted manuscript. For information on re-use, please refer to the publisher’s terms and conditions.
Keywords: Implants, Downlink, Uplink, Protocols, Lead, Wires, Frequency shift keying
UCL classification: UCL
UCL > Provost and Vice Provost Offices > UCL BEAMS
UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science
UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science > Dept of Electronic and Electrical Eng
URI: https://discovery.ucl.ac.uk/id/eprint/10090172
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