Naresh, Nibagani;
Fan, Yujia;
Zhu, Yijia;
Wang, Tianlei;
Li, Shuhui;
Parkin, Ivan P;
De Volder, Michael;
(2025)
3D Porous Metal‐Scaffold Interdigitated Micro‐Electrodes for High‐Performance On‐Chip Energy Storage Systems.
Advanced Functional Materials
, Article 2507537. 10.1002/adfm.202507537.
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Deka Boruah_Adv Funct Materials - 2025 - Naresh - 3D Porous Metal‐Scaffold Interdigitated Micro‐Electrodes for High‐Performance On‐Chip.pdf Download (5MB) | Preview |
Abstract
The development of on‐chip energy storage systems is essential for the next generation of System‐on‐Chip (SoC) technologies, particularly in powering micro‐scale devices such as medical implants, micro‐robots, and micro‐sensors. Enhancing charge storage performance within a limited device footprint remains a key challenge, necessitating advancements in electrode design to improve energy storage capabilities. In this work, porous 3D copper (Cu) scaffold‐based interdigitated electrodes (IDEs) are introduced as current collectors, where the dynamic hydrogen bubble templating (DHBT) method is employed to fabricate porous Cu scaffold IDEs, resulting in a structured porous network with increasing porosity at the top surface. This design greatly enhances the efficient loading of electrode materials of polyaniline (PANI) cathode and zinc (Zn) anode, thereby improving charge storage performance in Zn‐ion micro‐batteries (3D ZIMBs) and facilitating the deposition of activated carbon (AC) on 3D porous Cu for 3D micro‐supercapacitors (3D MSCs). Our results demonstrate a substantial improvement in charge storage for 3D ZIMBs, achieving 32.46 µAh cm−2 compared to ZIMBs (PANI and Zn deposited on plane Au IDEs) with 16.99 µAh cm−2 at 100 µA cm−2. Similarly, the 3D MSCs exhibit an areal capacitance of 22.81 mF cm−2 at 0.1 mA cm−2, outperforming MSCs (AC deposited on plane Au IDEs) with 4.52 mF cm−2. Furthermore, the 3D ZIMBs and 3D MSCs achieve impressive areal energies of 29.62 and 4.04 µWh cm−2, respectively, outperforming most reported high‐performance on‐chip energy storage systems. Therefore, this study presents an innovative strategy to enhance the electrochemical performance of planar energy storage systems and contribute to the advancement of on‐chip energy storage research.
| Type: | Article |
|---|---|
| Title: | 3D Porous Metal‐Scaffold Interdigitated Micro‐Electrodes for High‐Performance On‐Chip Energy Storage Systems |
| Open access status: | An open access version is available from UCL Discovery |
| DOI: | 10.1002/adfm.202507537 |
| Publisher version: | https://doi.org/10.1002/adfm.202507537 |
| Language: | English |
| Additional information: | © 2025 The Author(s). Advanced Functional Materials published by Wiley-VCH GmbH This is an open access article under the terms of the Creative Commons Attribution License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited. |
| Keywords: | 3D porous copper scaffold; Dynamic hydrogen bubble templating; Highperformance; On-chip energy storage |
| UCL classification: | UCL UCL > Provost and Vice Provost Offices > UCL BEAMS UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Maths and Physical Sciences UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Maths and Physical Sciences > MAPS Faculty Office UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Maths and Physical Sciences > MAPS Faculty Office > Institute for Materials Discovery |
| URI: | https://discovery.ucl.ac.uk/id/eprint/10208495 |
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