Keeble, Lewis; Jaccottet, Arthur; Ma, Daryl; Rodriguez-Manzano, Jesus; Georgiou, Pantelis; (2024) An electroplated Ag/AgCl quasi-reference electrode based on CMOS top-metal for electrochemical sensing. Electrochimica Acta , 477 , Article 143780. 10.1016/j.electacta.2024.143780.

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Abstract

The integration and mass-production of reference electrodes for CMOS-based electrochemical sensing systems pose a challenge for the accessibility and commercial-viability of such devices. In this paper, a method of electroplating an Ag/AgCl quasi-reference electrode using CMOS top-metal as a base is presented for the first time. The aluminium bond-pad of a CMOS microchip was zincated, an electroless nickel immersion gold layer applied, and a thick silver layer electroplated and chemically chlorinated. The resulting reference electrode was able to provide a stable potential with a drift rate of 0.3 mV/h for up to 18 h. This validates the approach of a fully electroplated bond-pad reference electrode, which offers simplified post-processing and greater scalability of production. Further work towards an entirely electroless process is envisaged

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