Williams, PE;
Walsh-Korb, Z;
Jones, ST;
Lan, Y;
Scherman, OA;
(2018)
Stress dissipation in cucurbit [8] uril ternary complex small molecule adhesives.
Langmuir
, 34
(44)
pp. 13104-13109.
10.1021/acs.langmuir.8b00894.
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Abstract
The ability to control supramolecular and macroscopic self-assembly and disassembly holds great potential for responsive, reversible adhesives that can efficiently broker stresses accumulated between two surfaces. Here, cucurbit[8]uril is used to directly adhere two functionalized mica substrates creating surface–surface interactions that are held together through photoreversible CB[8] heteroternary complexes. Comparison of single-molecule, bulk, and macroscopic adhesion behavior give insight into cooperativity and stress dissipation in dynamic adhesive systems.
| Type: | Article |
|---|---|
| Title: | Stress dissipation in cucurbit [8] uril ternary complex small molecule adhesives |
| Open access status: | An open access version is available from UCL Discovery |
| DOI: | 10.1021/acs.langmuir.8b00894 |
| Publisher version: | https://doi.org/10.1021/acs.langmuir.8b00894 |
| Language: | English |
| Additional information: | This version is the author accepted manuscript. For information on re-use, please refer to the publisher’s terms and conditions. |
| UCL classification: | UCL UCL > Provost and Vice Provost Offices > UCL BEAMS UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science > Dept of Chemical Engineering |
| URI: | https://discovery.ucl.ac.uk/id/eprint/10077384 |
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