A Survey of Emerging Interconnects for On-Chip Efficient Multicast and Broadcast in Many-Cores

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A Survey of Emerging Interconnects for On-Chip Efficient Multicast and Broadcast in Many-Cores

Karkar, A; Mak, T; Tong, K-F; Yakovlev, A; (2016) A Survey of Emerging Interconnects for On-Chip Efficient Multicast and Broadcast in Many-Cores. IEEE Circuits and Systems Magazine , 16 (1) pp. 58-72. 10.1109/MCAS.2015.2510199. Green open access

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Abstract

Networks-on-chip (NoC) have emerged to tackle different on-chip communication challenges and can satisfy different demands in terms of performance, cost and reliability. Currently, interconnects based on metal are reaching performance limits given relentless technology scaling. In particular, a performance bottleneck has emerged due to the demands for communication in terms of bandwidth for multicasting and broadcasting. As a result, various state-of-the-art architectures have been proposed as alternatives and emerging interconnects including the use of optics or radio frequency (RF). This article presents a comprehensive survey of these various interconnect fabrics, and discusses their current and future potentials and obstacles as well. This article aims to drive the research community to achieve a better utilization of the merits of on-chip interconnects and addresses the challenges involved. New interconnect technologies, such as optical interconnect, wireless NoC (WiNoC), RF transmission lines (RF-I) and surface wave interconnects (SWI), are discussed, evaluated and compared. Consequently, these emerging interconnects can continue to provide the cost efficiency and performance that are highly demanded for future many-core processors and high performance computing.

Type:	Article
Title:	A Survey of Emerging Interconnects for On-Chip Efficient Multicast and Broadcast in Many-Cores
Open access status:	An open access version is available from UCL Discovery
DOI:	10.1109/MCAS.2015.2510199
Publisher version:	https://doi.org/10.1109/MCAS.2015.2510199
Language:	English
Additional information:	This version is the author accepted manuscript. For information on re-use, please refer to the publisher’s terms and conditions.
Keywords:	Network-on-chip, Integrated circuit interconnections, System-on-chip, Radio frequency, Multicast communication, Bandwidth allocation
UCL classification:	UCL UCL > Provost and Vice Provost Offices > UCL BEAMS UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science > Dept of Electronic and Electrical Eng
URI:	https://discovery.ucl.ac.uk/id/eprint/1478620