UCL Discovery
UCL home » Library Services » Electronic resources » UCL Discovery

Voiding in Parylene-C Encapsulation of Surface Mount LEDs for an Optogenetic Epilepsy Neuroprosthesis

Idil, Ahmad Shah; Bailey, Richard; Escobedo-Cousin, Enrique; Gausden, Johannes; O'Neill, Antony; Donaldson, Nick; (2024) Voiding in Parylene-C Encapsulation of Surface Mount LEDs for an Optogenetic Epilepsy Neuroprosthesis. In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). (pp. pp. 1-5). IEEE: Cambridge, United Kingdom. Green open access

[thumbnail of Donaldson_94831-voiding-in-parylene-c-encapsulation-of-surface-mount-leds-for-an-optogenetic-epilepsy-neuroprosthesis.pdf]
Preview
Text
Donaldson_94831-voiding-in-parylene-c-encapsulation-of-surface-mount-leds-for-an-optogenetic-epilepsy-neuroprosthesis.pdf - Accepted Version

Download (3MB) | Preview

Abstract

It is often assumed that Parylene-C encapsulation films are void-free & conformal by nature of their vapour deposition. We present a case study in an optrode device where voiding occurs; we argue the voids originate from the geometry of the substrate and from the use of surface mount components. The segment under study consists of a commercial LED bonded with Au/Au thermosonic bonding onto a custom silicon substrate. We demonstrate via micro-sectioning that there is polymer voiding behaviour (1) in sub-LED surfaces; and (2) within through-hole vias in the silicon substrate (channels designed to allow polymer vapour ingress during deposition). By making a comparison to the solutions found in the IC industry around tungsten vapour filling of blind vias, we present geometric solutions for failure mitigation.

Type: Proceedings paper
Title: Voiding in Parylene-C Encapsulation of Surface Mount LEDs for an Optogenetic Epilepsy Neuroprosthesis
Event: 24th European Microelectronics and Packaging Conference (EMPC2023)
Dates: 11 Sep 2023 - 14 Sep 2023
ISBN-13: 978-0-9568086-9-1
Open access status: An open access version is available from UCL Discovery
DOI: 10.23919/EMPC55870.2023.10418444
Publisher version: https://doi.org/10.23919/empc55870.2023.10418444
Language: English
Additional information: This version is the author accepted manuscript. For information on re-use, please refer to the publisher’s terms and conditions.
Keywords: Optrodes, neuroprostheses, Parylene-C, voids, encapsulation, micropackaging
UCL classification: UCL
UCL > Provost and Vice Provost Offices > UCL BEAMS
UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science > Dept of Med Phys and Biomedical Eng
URI: https://discovery.ucl.ac.uk/id/eprint/10209352
Downloads since deposit
11Downloads
Download activity - last month
Download activity - last 12 months
Downloads by country - last 12 months

Archive Staff Only

View Item View Item