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Co-Package Technology Platform for Low-Power and Low-Cost Data Centers

Papatryfonos, K; Selviah, D; Maman, A; Hasharoni, K; Brimont, A; Zanzi, A; Kraft, J; ... Tekin, T; + view all (2021) Co-Package Technology Platform for Low-Power and Low-Cost Data Centers. Applied Sciences , 11 (13) , Article 6098. 10.3390/app11136098. Green open access

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Abstract

We report recent advances in photonic–electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel modulation schemes based on slow light modulation were developed to assist in achieving an efficient performance of the module. Integration of DFB laser sources within each cell in the matrix was demonstrated as well using wafer bonding between the InP and SOI wafers. Improved semiconductor quantum dot MBE growth, characterization and gain stack designs were developed. Packaging of these 2D photonic arrays in a chiplet configuration was demonstrated using a vertical integration approach in which the optical interconnect matrix was flip-chip assembled on top of a CMOS mimic chip with 2D vertical fiber coupling. The optical chiplet was further assembled on a substrate to facilitate integration with the multi-chip module of the co-packaged system with a switch surrounded by several such optical chiplets. We summarize the features of the L3MATRIX co-package technology platform and its holistic toolbox of technologies to address the next generation of computing challenges.

Type: Article
Title: Co-Package Technology Platform for Low-Power and Low-Cost Data Centers
Open access status: An open access version is available from UCL Discovery
DOI: 10.3390/app11136098
Publisher version: https://doi.org/10.3390/app11136098
Language: English
Additional information: This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited
Keywords: Silicon photonics, 3D device integration, hybrid integration, optical interconnects, quantum well hybrid laser, quantum dots, WDM, CWDM, slow-light modulators, co-package
UCL classification: UCL
UCL > Provost and Vice Provost Offices > UCL BEAMS
UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science
UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science > Dept of Electronic and Electrical Eng
URI: https://discovery.ucl.ac.uk/id/eprint/10131815
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