Yao, W;
Liu, X;
Matters-Kammerer, M;
Meighan, A;
Spiegelberg, M;
Trajkovic, M;
Van der Tol, JJGM;
... Williams, KA; + view all
(2020)
Towards the integration of InP photonics with silicon electronics: design and technology challenges.
Journal of Lightwave Technology
10.1109/JLT.2020.3043799.
(In press).
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Abstract
Intimate integration of photonics with electronics is regarded as the key to further improvement in bandwidth, speed and energy efficiency of information transport systems. Here, a method based on wafer-scale polymer bonding is reviewed which is compatible with foundry-sourced high-performance InP photonics and BiCMOS electronics. We address challenges with respect to circuit architecture, co-simulation framework and interconnect technology and introduce our approach that can lead to broadband high-density interconnects between photonics and electronics. Recent proof-of-concept work utilizing DC-coupled driver connections to modulators, which significantly reduces the interconnect complexity, is summarized. Furthermore, co-simulation concepts based on equivalent circuit models are discussed with emphasis on the importance of impedance matching between driver and modulator. Finally, realizations of broadband interconnects and functional photonic building blocks after wafer bonding are highlighted to demonstrate the potential of this wafer-scale co-integration method.
| Type: | Article |
|---|---|
| Title: | Towards the integration of InP photonics with silicon electronics: design and technology challenges |
| Open access status: | An open access version is available from UCL Discovery |
| DOI: | 10.1109/JLT.2020.3043799 |
| Publisher version: | https://doi.org/10.1109/JLT.2020.3043799 |
| Language: | English |
| Additional information: | This version is the author accepted manuscript. For information on re-use, please refer to the publisher’s terms and conditions. |
| Keywords: | Photonic integrated circuits, wafer scale integration, BiCMOS integrated circuits, optical transceiver, electronic photonic integration |
| UCL classification: | UCL UCL > Provost and Vice Provost Offices > UCL BEAMS UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science > Dept of Electronic and Electrical Eng |
| URI: | https://discovery.ucl.ac.uk/id/eprint/10118847 |
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