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Polishing, preparation and patterning of diamond for device applications

Hicks, ML; Pakpour-Tabrizi, AC; Jackman, RB; (2019) Polishing, preparation and patterning of diamond for device applications. Diamond and Related Materials , 97 , Article 107424. 10.1016/j.diamond.2019.05.010. Green open access

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Abstract

Central to future electronic device developments in diamond is the provision of smooth, low defect density substrate materials. This review examines plasma treatments of diamond to enable smoothing of rough surfaces, the removal of damage created by various non-plasma polishing processes previously applied and for patterning into device structures. The favoured reported plasma treatments for surface smoothing are detailed. The characterisation, effectiveness and other fabrication considerations of each plasma process are discussed. Despite significant recent progress the processing technology associated with plasma-etching diamond remains immature when compared to those used for conventional semiconductor materials.

Type: Article
Title: Polishing, preparation and patterning of diamond for device applications
Open access status: An open access version is available from UCL Discovery
DOI: 10.1016/j.diamond.2019.05.010
Publisher version: https://doi.org/10.1016/j.diamond.2019.05.010
Language: English
Additional information: This version is the author accepted manuscript. For information on re-use, please refer to the publisher’s terms and conditions.
Keywords: Synthetic diamond, Etching, Polishing, Reactive ion etching, Defect characterisation, Surface characterisation
UCL classification: UCL
UCL > Provost and Vice Provost Offices > UCL BEAMS
UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science
UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science > Dept of Electronic and Electrical Eng
URI: https://discovery.ucl.ac.uk/id/eprint/10076412
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