Hicks, ML;
Pakpour-Tabrizi, AC;
Jackman, RB;
(2019)
Polishing, preparation and patterning of diamond for device applications.
Diamond and Related Materials
, 97
, Article 107424. 10.1016/j.diamond.2019.05.010.
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Abstract
Central to future electronic device developments in diamond is the provision of smooth, low defect density substrate materials. This review examines plasma treatments of diamond to enable smoothing of rough surfaces, the removal of damage created by various non-plasma polishing processes previously applied and for patterning into device structures. The favoured reported plasma treatments for surface smoothing are detailed. The characterisation, effectiveness and other fabrication considerations of each plasma process are discussed. Despite significant recent progress the processing technology associated with plasma-etching diamond remains immature when compared to those used for conventional semiconductor materials.
| Type: | Article |
|---|---|
| Title: | Polishing, preparation and patterning of diamond for device applications |
| Open access status: | An open access version is available from UCL Discovery |
| DOI: | 10.1016/j.diamond.2019.05.010 |
| Publisher version: | https://doi.org/10.1016/j.diamond.2019.05.010 |
| Language: | English |
| Additional information: | This version is the author accepted manuscript. For information on re-use, please refer to the publisher’s terms and conditions. |
| Keywords: | Synthetic diamond, Etching, Polishing, Reactive ion etching, Defect characterisation, Surface characterisation |
| UCL classification: | UCL UCL > Provost and Vice Provost Offices > UCL BEAMS UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science > Dept of Electronic and Electrical Eng |
| URI: | https://discovery.ucl.ac.uk/id/eprint/10076412 |
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