eprintid: 10190389
rev_number: 12
eprint_status: archive
userid: 699
dir: disk0/10/19/03/89
datestamp: 2024-04-09 02:38:22
lastmod: 2024-04-11 00:36:12
status_changed: 2024-04-11 00:36:12
type: proceedings_section
metadata_visibility: show
sword_depositor: 699
creators_name: Ali, I
creators_name: Xue, F
creators_name: Henriquez, CP
creators_name: Niederhoffer, T
creators_name: Idil, AS
creators_name: Iang, DJ
creators_name: Lancashire, HT
title: Initial L ife Test of Silicone E ncapsulated FR 4 Printed Circuit Boards for Pre-Clinical A ctive Implants
ispublished: pub
divisions: UCL
divisions: B04
divisions: C05
divisions: F46
divisions: F42
keywords: life test, encapsulation, printed circuit board,
impedance, FR4, solder
note: This version is the author accepted manuscript. For information on re-use, please refer to the publisher’s terms and conditions.
abstract: Silicone encapsulated FR 4 printed circuit boards may provide a rapid solution for protecting pre-clinical prototype implant electronics. Interdigitated electrodes (IDE s) with and without solder coating were manufactured on Cu-FR 4 laminates and silicone encapsulated (N = 14). IDE s were aged in saline and change in impedance was measured. Solder coated IDE s had stable 1 kHz impedances throughout the aging period with promising lifetimes for pre-clinical prototypes. A single uncoated IDE failed with a fall in impedance and verdigris. Other uncoated IDEs showed increasing impedance and dark copper(II) oxide. Failures attributable to contaminants and moisture ingress are under investigation.
date: 2024-03-06
date_type: published
publisher: IMAPS - International Microelectronics Assembly and Packaging Society
official_url: http://dx.doi.org/10.4071/001c.94758
oa_status: green
full_text_type: other
language: eng
primo: open
primo_central: open_green
verified: verified_manual
elements_id: 2262105
doi: 10.4071/001c.94758
lyricists_name: Lancashire, Henry
lyricists_name: Niederhoffer, Thomas
lyricists_name: Jiang, Dai
lyricists_id: HTLAN52
lyricists_id: TNIED28
lyricists_id: DJIAN68
actors_name: Lancashire, Henry
actors_id: HTLAN52
actors_role: owner
full_text_status: public
pres_type: paper
publication: Advancing Microelectronics
volume: 2023
number: EMPC
pagerange: 224-227
issn: 2222-8748
book_title: IMAPSource Proceedings 2023 (EMPC)
citation:        Ali, I;    Xue, F;    Henriquez, CP;    Niederhoffer, T;    Idil, AS;    Iang, DJ;    Lancashire, HT;      (2024)    Initial L ife Test of Silicone E ncapsulated FR 4 Printed Circuit Boards for Pre-Clinical A ctive Implants.                     In:  IMAPSource Proceedings 2023 (EMPC).  (pp. pp. 224-227).  IMAPS - International Microelectronics Assembly and Packaging Society       Green open access   
 
document_url: https://discovery.ucl.ac.uk/id/eprint/10190389/1/EMPC_1038_v2.pdf