%I IMAPS - International Microelectronics Assembly and Packaging Society
%L discovery10190389
%J Advancing Microelectronics
%K life test, encapsulation, printed circuit board,
impedance, FR4, solder
%X Silicone encapsulated FR 4 printed circuit boards may provide a rapid solution for protecting pre-clinical prototype implant electronics. Interdigitated electrodes (IDE s) with and without solder coating were manufactured on Cu-FR 4 laminates and silicone encapsulated (N = 14). IDE s were aged in saline and change in impedance was measured. Solder coated IDE s had stable 1 kHz impedances throughout the aging period with promising lifetimes for pre-clinical prototypes. A single uncoated IDE failed with a fall in impedance and verdigris. Other uncoated IDEs showed increasing impedance and dark copper(II) oxide. Failures attributable to contaminants and moisture ingress are under investigation.
%O This version is the author accepted manuscript. For information on re-use, please refer to the publisher’s terms and conditions.
%A I Ali
%A F Xue
%A CP Henriquez
%A T Niederhoffer
%A AS Idil
%A DJ Iang
%A HT Lancashire
%V 2023
%T Initial L ife Test of Silicone E ncapsulated FR 4 Printed Circuit Boards for Pre-Clinical A ctive Implants
%B IMAPSource Proceedings 2023 (EMPC)
%N EMPC
%P 224-227
%D 2024