TY  - GEN
SP  - 224
N1  - This version is the author accepted manuscript. For information on re-use, please refer to the publisher?s terms and conditions.
KW  - life test
KW  -  encapsulation
KW  -  printed circuit board
KW  - 
impedance
KW  -  FR4
KW  -  solder
PB  - IMAPS - International Microelectronics Assembly and Packaging Society
A1  - Ali, I
A1  - Xue, F
A1  - Henriquez, CP
A1  - Niederhoffer, T
A1  - Idil, AS
A1  - Iang, DJ
A1  - Lancashire, HT
AV  - public
TI  - Initial L ife Test of Silicone E ncapsulated FR 4 Printed Circuit Boards for Pre-Clinical A ctive Implants
SN  - 2222-8748
Y1  - 2024/03/06/
ID  - discovery10190389
UR  - http://dx.doi.org/10.4071/001c.94758
EP  - 227
N2  - Silicone encapsulated FR 4 printed circuit boards may provide a rapid solution for protecting pre-clinical prototype implant electronics. Interdigitated electrodes (IDE s) with and without solder coating were manufactured on Cu-FR 4 laminates and silicone encapsulated (N = 14). IDE s were aged in saline and change in impedance was measured. Solder coated IDE s had stable 1 kHz impedances throughout the aging period with promising lifetimes for pre-clinical prototypes. A single uncoated IDE failed with a fall in impedance and verdigris. Other uncoated IDEs showed increasing impedance and dark copper(II) oxide. Failures attributable to contaminants and moisture ingress are under investigation.
ER  -