%0 Generic
%A Ali, I
%A Xue, F
%A Henriquez, CP
%A Niederhoffer, T
%A Idil, AS
%A Iang, DJ
%A Lancashire, HT
%D 2024
%F discovery:10190389
%I IMAPS - International Microelectronics Assembly and Packaging Society
%K life test, encapsulation, printed circuit board,  impedance, FR4, solder
%N EMPC
%P 224-227
%T Initial L ife Test of Silicone E ncapsulated FR 4 Printed Circuit Boards for Pre-Clinical A ctive Implants
%U https://discovery.ucl.ac.uk/id/eprint/10190389/
%V 2023
%X Silicone encapsulated FR 4 printed circuit boards may provide a rapid solution for protecting pre-clinical prototype implant electronics. Interdigitated electrodes (IDE s) with and without solder coating were manufactured on Cu-FR 4 laminates and silicone encapsulated (N = 14). IDE s were aged in saline and change in impedance was measured. Solder coated IDE s had stable 1 kHz impedances throughout the aging period with promising lifetimes for pre-clinical prototypes. A single uncoated IDE failed with a fall in impedance and verdigris. Other uncoated IDEs showed increasing impedance and dark copper(II) oxide. Failures attributable to contaminants and moisture ingress are under investigation.
%Z This version is the author accepted manuscript. For information on re-use, please refer to the publisher’s terms and conditions.