?url_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Adc&rft.title=Initial+L+ife+Test+of+Silicone+E+ncapsulated+FR+4+Printed+Circuit+Boards+for+Pre-Clinical+A+ctive+Implants&rft.creator=Ali%2C+I&rft.creator=Xue%2C+F&rft.creator=Henriquez%2C+CP&rft.creator=Niederhoffer%2C+T&rft.creator=Idil%2C+AS&rft.creator=Iang%2C+DJ&rft.creator=Lancashire%2C+HT&rft.description=Silicone+encapsulated+FR+4+printed+circuit+boards+may+provide+a+rapid+solution+for+protecting+pre-clinical+prototype+implant+electronics.+Interdigitated+electrodes+(IDE+s)+with+and+without+solder+coating+were+manufactured+on+Cu-FR+4+laminates+and+silicone+encapsulated+(N+%3D+14).+IDE+s+were+aged+in+saline+and+change+in+impedance+was+measured.+Solder+coated+IDE+s+had+stable+1+kHz+impedances+throughout+the+aging+period+with+promising+lifetimes+for+pre-clinical+prototypes.+A+single+uncoated+IDE+failed+with+a+fall+in+impedance+and+verdigris.+Other+uncoated+IDEs+showed+increasing+impedance+and+dark+copper(II)+oxide.+Failures+attributable+to+contaminants+and+moisture+ingress+are+under+investigation.&rft.subject=life+test%2C+encapsulation%2C+printed+circuit+board%2C%0D%0Aimpedance%2C+FR4%2C+solder&rft.publisher=IMAPS+-+International+Microelectronics+Assembly+and+Packaging+Society&rft.date=2024-03-06&rft.type=Proceedings+paper&rft.language=eng&rft.source=+++++In%3A++IMAPSource+Proceedings+2023+(EMPC).++(pp.+pp.+224-227).++IMAPS+-+International+Microelectronics+Assembly+and+Packaging+Society+(2024)+++++&rft.format=text&rft.identifier=https%3A%2F%2Fdiscovery.ucl.ac.uk%2Fid%2Feprint%2F10190389%2F1%2FEMPC_1038_v2.pdf&rft.identifier=https%3A%2F%2Fdiscovery.ucl.ac.uk%2Fid%2Feprint%2F10190389%2F&rft.rights=open