@inproceedings{discovery10190389,
       publisher = {IMAPS - International Microelectronics Assembly and Packaging Society},
       booktitle = {IMAPSource Proceedings 2023 (EMPC)},
          volume = {2023},
           month = {March},
            year = {2024},
           title = {Initial L ife Test of Silicone E ncapsulated FR 4 Printed Circuit Boards for Pre-Clinical A ctive Implants},
         journal = {Advancing Microelectronics},
          number = {EMPC},
            note = {This version is the author accepted manuscript. For information on re-use, please refer to the publisher's terms and conditions.},
           pages = {224--227},
            issn = {2222-8748},
        keywords = {life test, encapsulation, printed circuit board,
impedance, FR4, solder},
             url = {http://dx.doi.org/10.4071/001c.94758},
        abstract = {Silicone encapsulated FR 4 printed circuit boards may provide a rapid solution for protecting pre-clinical prototype implant electronics. Interdigitated electrodes (IDE s) with and without solder coating were manufactured on Cu-FR 4 laminates and silicone encapsulated (N = 14). IDE s were aged in saline and change in impedance was measured. Solder coated IDE s had stable 1 kHz impedances throughout the aging period with promising lifetimes for pre-clinical prototypes. A single uncoated IDE failed with a fall in impedance and verdigris. Other uncoated IDEs showed increasing impedance and dark copper(II) oxide. Failures attributable to contaminants and moisture ingress are under investigation.},
          author = {Ali, I and Xue, F and Henriquez, CP and Niederhoffer, T and Idil, AS and Iang, DJ and Lancashire, HT}
}