TY - JOUR JF - Electrochimica Acta N1 - © 2024 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/). ID - discovery10185432 Y1 - 2024/01// PB - Elsevier BV TI - An electroplated Ag/AgCl quasi-reference electrode based on CMOS top-metal for electrochemical sensing AV - public N2 - The integration and mass-production of reference electrodes for CMOS-based electrochemical sensing systems pose a challenge for the accessibility and commercial-viability of such devices. In this paper, a method of electroplating an Ag/AgCl quasi-reference electrode using CMOS top-metal as a base is presented for the first time. The aluminium bond-pad of a CMOS microchip was zincated, an electroless nickel immersion gold layer applied, and a thick silver layer electroplated and chemically chlorinated. The resulting reference electrode was able to provide a stable potential with a drift rate of 0.3 mV/h for up to 18 h. This validates the approach of a fully electroplated bond-pad reference electrode, which offers simplified post-processing and greater scalability of production. Further work towards an entirely electroless process is envisaged VL - 477 KW - CMOS KW - Reference electrode KW - Electroplating KW - Electrochemical KW - Electroless SN - 0013-4686 UR - http://dx.doi.org/10.1016/j.electacta.2024.143780 A1 - Keeble, Lewis A1 - Jaccottet, Arthur A1 - Ma, Daryl A1 - Rodriguez-Manzano, Jesus A1 - Georgiou, Pantelis ER -