TY  - JOUR
JF  - Electrochimica Acta
N1  - © 2024 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/).
ID  - discovery10185432
Y1  - 2024/01//
PB  - Elsevier BV
TI  - An electroplated Ag/AgCl quasi-reference electrode based on CMOS top-metal for electrochemical sensing
AV  - public
N2  - The integration and mass-production of reference electrodes for CMOS-based electrochemical sensing systems
pose a challenge for the accessibility and commercial-viability of such devices. In this paper, a method of
electroplating an Ag/AgCl quasi-reference electrode using CMOS top-metal as a base is presented for the first
time. The aluminium bond-pad of a CMOS microchip was zincated, an electroless nickel immersion gold layer
applied, and a thick silver layer electroplated and chemically chlorinated. The resulting reference electrode was
able to provide a stable potential with a drift rate of 0.3 mV/h for up to 18 h. This validates the approach of a
fully electroplated bond-pad reference electrode, which offers simplified post-processing and greater scalability
of production. Further work towards an entirely electroless process is envisaged
VL  - 477
KW  - CMOS
KW  - 
Reference electrode
KW  - 
Electroplating
KW  - 
Electrochemical
KW  - 
Electroless
SN  - 0013-4686
UR  - http://dx.doi.org/10.1016/j.electacta.2024.143780
A1  - Keeble, Lewis
A1  - Jaccottet, Arthur
A1  - Ma, Daryl
A1  - Rodriguez-Manzano, Jesus
A1  - Georgiou, Pantelis
ER  -