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<https://discovery.ucl.ac.uk/id/eprint/10185432> <http://purl.org/dc/terms/title> "An electroplated Ag/AgCl quasi-reference electrode based on CMOS top-metal for electrochemical sensing"^^<http://www.w3.org/2001/XMLSchema#string> .
<https://discovery.ucl.ac.uk/id/eprint/10185432> <http://purl.org/ontology/bibo/abstract> "The integration and mass-production of reference electrodes for CMOS-based electrochemical sensing systems\r\npose a challenge for the accessibility and commercial-viability of such devices. In this paper, a method of\r\nelectroplating an Ag/AgCl quasi-reference electrode using CMOS top-metal as a base is presented for the first\r\ntime. The aluminium bond-pad of a CMOS microchip was zincated, an electroless nickel immersion gold layer\r\napplied, and a thick silver layer electroplated and chemically chlorinated. The resulting reference electrode was\r\nable to provide a stable potential with a drift rate of 0.3 mV/h for up to 18 h. This validates the approach of a\r\nfully electroplated bond-pad reference electrode, which offers simplified post-processing and greater scalability\r\nof production. Further work towards an entirely electroless process is envisaged"^^<http://www.w3.org/2001/XMLSchema#string> .
<https://discovery.ucl.ac.uk/id/eprint/10185432> <http://purl.org/dc/terms/date> "2024-01" .
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