Test chip for evaluating the packaging techniques for biomedical implantable devices.
In: James, CJ and Demanuele, C and Jimenez-Gonzalez, A, (eds.)
Proceedings of the 5th UKRI PG Conference in Biomedical Engineering and Medical Physics 2009: PGBIOMED09: 12 – 14 July 2009: University of Oxford.
(pp. 65 - 66).
IEEE UKRI EMB Student Club: UK.
In this paper we briefly report on the development of a set of test chips that can be used to verify the sealing techniques with biomedical implants as their target application. These test chips have been designed and fabricated based on the Tyndall’s inhouse CMOS 1.5 micron technology. Each chip includes humidity, temperature and/or corrosion sensors. Different designs and sizes have been considered for these sensors to compare the sensors sensitivity and to select the optimum ones for the final chip. The sensors are being tested and the result obtained for one of the humidity sensors is presented.
|Title:||Test chip for evaluating the packaging techniques for biomedical implantable devices|
|UCL classification:||UCL > School of BEAMS > Faculty of Engineering Science > Electronic and Electrical Engineering
UCL > School of BEAMS > Faculty of Engineering Science > Medical Physics and Bioengineering
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