Test chip for evaluating the packaging techniques for biomedical implantable devices.
Presented at: UNSPECIFIED.
In this paper we briefly report on the development of a set of test chips that can be used to verify the sealing techniques with biomedical implants as their target application. These test chips have been designed and fabricated based on the Tyndall’s inhouse CMOS 1.5 micron technology. Each chip includes humidity, temperature and/or corrosion sensors. Different designs and sizes have been considered for these sensors to compare the sensors sensitivity and to select the optimum ones for the final chip. The sensors are being tested and the result obtained for one of the humidity sensors is presented.
|Type:||Conference item (UNSPECIFIED)|
|Title:||Test chip for evaluating the packaging techniques for biomedical implantable devices|
|UCL classification:||UCL > School of BEAMS > Faculty of Engineering Science
UCL > School of BEAMS > Faculty of Engineering Science > Electronic and Electrical Engineering
UCL > School of BEAMS > Faculty of Engineering Science > Medical Physics and Bioengineering
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