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A FEASIBILITY STUDY FOR THE FABRICATION OF PLANAR SILICON MULTICHIP MODULES USING ELECTRON-BEAM LITHOGRAPHY FOR PRECISE LOCATION AND INTERCONNECTION OF CHIPS

HOPPER, A; JONES, A; AUGUR, RA; FICE, MJ; BLYTHE, S; AHMED, H; (1992) A FEASIBILITY STUDY FOR THE FABRICATION OF PLANAR SILICON MULTICHIP MODULES USING ELECTRON-BEAM LITHOGRAPHY FOR PRECISE LOCATION AND INTERCONNECTION OF CHIPS. IEEE T COMPON HYBR , 15 (1) 97 - 102.

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Abstract

A technique for fabricating multichip modules (MCM's) by mounting chips in holes etched into silicon motherboards is described. With this approach the front faces of the chips are coplanar with the front of the motherboard, and hence, the connections between the chips and the motherboards may be made by standard thin film processes. A method for fabricating such modules using electron beam lithography to locate the chips and to define the interconnections between the chips and the motherboard is discussed. The feasibility of the processes is demonstrated with measurements on a module designed and fabricated to test the stability of the processes.

Type: Article
Title: A FEASIBILITY STUDY FOR THE FABRICATION OF PLANAR SILICON MULTICHIP MODULES USING ELECTRON-BEAM LITHOGRAPHY FOR PRECISE LOCATION AND INTERCONNECTION OF CHIPS
Keywords: FOCUSED ION-BEAM, PACKAGE, TECHNOLOGY
UCL classification: UCL > Provost and Vice Provost Offices
UCL > Provost and Vice Provost Offices > UCL BEAMS
UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science
UCL > Provost and Vice Provost Offices > UCL BEAMS > Faculty of Engineering Science > Dept of Electronic and Electrical Eng
URI: http://discovery.ucl.ac.uk/id/eprint/118459
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