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Four-Wire Interface ASIC for a Multi-Implant Link

Ghoreishizadeh, SS; Haci, D; Liu, Y; Donaldson, N; Constandinou, TG; (2017) Four-Wire Interface ASIC for a Multi-Implant Link. IEEE Transactions on Circuits and Systems I: Regular Papers , 64 (12) pp. 3056-3067. 10.1109/TCSI.2017.2731659. Green open access

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Abstract

This paper describes an on-chip interface for recovering power and providing full-duplex communication over an AC-coupled 4-wire lead between active implantable devices. The target application requires two modules to be implanted in the brain (cortex) and upper chest; connected via a subcutaneous lead. The brain implant consists of multiple identical “optrodes” that facilitate a bidirectional neural interface (electrical recording and optical stimulation), and the chest implant contains the power source (battery) and processor module. The proposed interface is integrated within each optrode ASIC allowing full-duplex and fully-differential communication based on Manchester encoding. The system features a head-to-chest uplink data rate (up to 1.6 Mbps) that is higher than that of the chest-to-head downlink (100 kbps), which is superimposed on a power carrier. On-chip power management provides an unregulated 5-V dc supply with up to 2.5-mA output current for stimulation, and two regulated voltages (3.3 and 3 V) with 60-dB power supply rejection ratio for recording and logic circuits. The 4-wire ASIC has been implemented in a 0.35-μm CMOS technology, occupying a 1.5-mm 2 silicon area, and consumes a quiescent current of 91.2 μA. The system allows power transmission with measured efficiency of up to 66% from the chest to the brain implant. The downlink and uplink communication are successfully tested in a system with two optrodes and through a 4-wire implantable lead.

Type: Article
Title: Four-Wire Interface ASIC for a Multi-Implant Link
Event: 8th IEEE Latin American Symposium on Circuits and Systems (LASCAS)
Location: Bariloche, ARGENTINA
Dates: 20 February 2017 - 23 February 2017
Open access status: An open access version is available from UCL Discovery
DOI: 10.1109/TCSI.2017.2731659
Publisher version: https://doi.org/10.1109/TCSI.2017.2731659
Language: English
Additional information: Copyright © 2017 IEEE. This is an Open Access article published under the IEEE Open Access Publishing Agreement
Keywords: Wires, Lead, Implants, Uplink, Downlink, Batteries, Impedance
UCL classification: UCL > Provost and Vice Provost Offices
UCL > Provost and Vice Provost Offices > School of Life and Medical Sciences
UCL > Provost and Vice Provost Offices > School of Life and Medical Sciences > Faculty of Medical Sciences
UCL > Provost and Vice Provost Offices > School of Life and Medical Sciences > Faculty of Medical Sciences > Div of Surgery and Interventional Sci
UCL > Provost and Vice Provost Offices > School of Life and Medical Sciences > Faculty of Medical Sciences > Div of Surgery and Interventional Sci > Department of Ortho and MSK Science
URI: http://discovery.ucl.ac.uk/id/eprint/10063269
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